| Features |
This machine can print a cream solder on the
print board.
This copies the cream solder with metal mask which matches to the board pattern.
This is made of Base Loading Equipment & Printing apart moving equipment on
Standard Spec.[TSP-100]
At first operator sets the board,and push the start button.Base is fed into Print
Station.The metal mask is moved to the up-down & to skiding.Then printes the
solder.After printing,base is push out and is stopped. |
| Specifications |
Board(Max) |
350×280mm |
| Board(Min) |
50×30mm |
| Thichkness of PCB |
0.5-2.5mm
Matching requlation of metal mask height |
| Board wrap |
withtin±1.0mm |
| Board position |
Reference hole method:attachment is 1 located-pin matched
board hole. |
| Option:match outline reference. |
| Board fixed table |
450×350mm |
| Support pin for Board Receiver 10pce. |
| Feed Stroke of Board Slide:520mm |
| Metal mask |
Mask frame measure:550×650mm |
| thickness:30mm or 25mm |
| position adjustment:adjust each way by micrometer head. |
| X.Y direction ±5mm θdirection ±1.5° |
| Printing rigin:x.y center of 150mm from front. |
| Mask fixing is done by cylinder. |
| Printing apart control |
Lift cam controll by cylinder Moving. |
| Printing apart velocity:0.5-10.0sec/2mm |
| Up-down movement stroke |
90mm
by cylinder |
| Squeegee |
squeegee number 2 pcs.(each 1 for left & right) |
| Plate Squeegee,Material:Urethan Rubber(Hard80°-90°) |
| t 10×30×300mm Enable 4 Directioh |
| slope angle 60° |
| Air Pressure:(adijustment zone 0.04MPa-2.2MPa) |
| stroke:Max 405mm(Printing Area Max350mm) |
| Velocity:20-60mm/sec(Established by volume.) |
| Driving:speed control motor ball screw driving. |
| Repeat Position accuracy |
±0.02mm It depends on P.C.B accuracy. |
| Control |
1 board computer(TENRYU 78K2 1 Chip Micon) |
| Power |
AC 100V 50/60Hz 3.0A |
| Air pressure |
0.5MPa Air consumption 15Nl |
| Machine measure |
W1,175×D880×H760mm |
| Machine weight |
about 240kg |
