| Features |
This machine can print a cream solder on the
print board.
This copies the cream solder with metal mask which matches to the board pattern.
At first operator sets the board,and push the start button.The metal mask is moved
to the up-down & to skiding.Then printes the solder. |
| Specifications |
Board(Max) |
350×280mm |
| Board(Min) |
50×30mm |
| Thichkness of PCB |
0.5-2.5mm
Matching requlation of metal mask height |
| Board wrap |
withtin±1.0mm |
| Board position |
Reference hole method:attachment is 1 located-pin matched
board hole. |
| Option:match outline reference. |
| Board fixed table |
450×350mm |
| Support pin for Board Receiver 10pce. |
| Option:board fixed by vaccum system(with vaccum pump) |
| Metal mask |
Mask frame measure:550×650mm |
| thickness:30mm or 25mm |
| position adjustment:adjust each way by micrometer head. |
| X.Y direction ±5mm θdirection ±1.5° |
| Printing rigin:x.y center of 150mm from front. |
| Mask fixing is done by cylinder. |
| Printing apart control |
Cylinder Moving. |
| Up-down movement stroke |
150mm
by cylinder |
| Squeegee |
squeegee number 2 pcs.(each 1 for left & right) |
| Plate Squeegee,Material:Urethan Rubber(Hard80°-90°) |
| t 10×30×300mm Enable 4 Directioh |
| slope angle 60° |
| Air Pressure:(adijustment zone 0.04MPa-2.2MPa) |
| stroke:Max 405mm(Printing Area Max350mm) |
| Velocity:20-60mm/sec(Established by volume.) |
| Driving:speed control motor ball screw driving. |
| Repeat Position accuracy |
±0.02mm It depends on P.C.B accuracy. |
| Control |
1 board computer(TENRYU 78K2 1 Chip Micon) |
| Power |
AC 100V 50/60Hz 3.0A |
| Air pressure |
0.5MPa Air consumption 10Nl |
| Machine measure |
W740×D880×H775mm |
| Machine weight |
about 180kg |
