| Features |
The compact & high speed printing press"TSP-10"is
optimal to the paste printing of a semiconductor and it is optimal to a solder
paste printing.
A/the table the set of work moves when the worker does and push a/the triggering
switch and do the printing of Cream solder etc.
As for printing condition etc.the numerical value input is possible by a touch
panel.
This device does not take a line space due to a compact design. |
| Specifications |
Board(Max) |
150×150mm |
| Board(Min) |
10×10mm |
| Thichkness of PCB |
0.1-4.0mm
Insert numbers |
| Board wrap |
withtin ±1.0mm |
| Board position |
Guided pin |
| Option:vacuum |
| Board fixed table |
200mm×250mm |
| board fixed by vaccum system |
| Metal mask |
mask frame measure:320×320mm |
| position adhustment:adjust each way by micrometer head. |
| Mask fixing is done by cylinder. |
Printing apart control |
Printing apart velocity:0.01-2.0mm/sec |
| PCB-down distance:0-2.00mm |
| Clearance:0-2.00mm |
| PCB-down step:1-5 |
Up-down movement stroke |
AC Servo Motor |
Squeegee |
Squeegee number 2 pcs.(each 1 for front & back) |
| Plate Squeegee,Material:Urethan Rubber(Hard80°-90°) |
| t 0.6×20W×160L Enable 4 directioh |
| slope angle60° |
| Air Pressure:(adijustment zone 0.01MPa-0.25MPa) |
| stroke:Max 405mm(Printing Area Max350mm) |
| Velocity:10-100mm/sec |
| Driving:speed control motor ball screw driving |
Repeat Position accuracy |
±0.02mm It depends on P.C.B accuracy. |
Control |
Sequencer |
Power |
AC 100V 50/60Hz 3.0A |
Air pressure |
0.5MPa Air consumption 12Nl |
Machine measure |
W500×D750×H1,240mm |
Machine weight |
about 220kg |
